Features

The two main features of the SMT book are:

1. Current Integration Technology

• CMOS products and processes

• Enhanced ion implantation

  • Twin wells
  • Retrogrades
  • Shallow junctions
    
    

• STI, shallow trench isolation

• Local interconnect

• Copper multi-level metallization

• 0.18-micron processes

• Phase-shift mask

• Step-n-scan lithography

• Chemically-amplified (CA) DUV resist

• CMP, chemical mechanical planarization

• Multi-level metal layers

• Low-k dielectric

• C4 bump (flip chip technology

2. Instructional Technology

• Authors experienced in SMT & education

• Logical topic order for ease of learning

• Common threads to link topics

• Quality measures and troubleshooting

• 720 illustrations, 50 photographs

• Review exercises with answers after every chapter

• Instructor's guide:
• CD ROM with PowerPoint presentations
• answers to end-of-chapter review questions
• a test bank of questions based on chapter reviews
• chapter summaries
• website with online help